xruirui的博客

Hybrid Memory Cube (HMC) is a single package containing four DRAM die and one logic die, all stacked together using through-silicon via (TSV) technology. Within each cube, memory is organized vertically— portions of each memory die are combined with the corresponding portions of the other memory die in the stack. Each grouping of memory partitions is combined with a corresponding section of the logic die, forming what is referred to as a vault. Specifications within this data sheet are compatible with the HMC Consortium Specification.

hmc_gen2_user_guide.pdf 高速动态存储。。

PLL_and_DLL(台湾版)

高级FPGA设计结构、实现和优化（英文原版）